Solution : Brute Force

The Semiconductor:

Image 1: Pinout

A crystal and a battery are soldered ontop of a semiconductor  (see Image 2 and 3) All parts are spilled together in a case.

Implementation:
The goal is it to lay the correspondent pins free. For that ou can crack the case with a knife or a sharp cutter.
You can lay everything free except the crystal, or it is enough if you you lay free pin 16 and 20

Pin 20: Cut the connection between IC and the glued battery. Solder the plus-pole of the external battery to the pin of the semiconductor.
Pin 16 : Solder the negative-pole of the external battery to the internal battery-pin. The connection between internal battery and the pin must not necessary be cutted.

I received another solution to crack the case: Instead of using a knife or a cutter, you can open it with an industrial heating fan (Sorry I don´t know the exact english translation. Imagine a hairdrier with much higher temperature).(Thanx Micha).

BE CAREFUL:
It´s better to not to cut the area of the crystal, its pins are a bit vulnerable. (I killed myself a semicondur with that , because I wasn´t careful enough. and i have no clue which value the Crystal has, but I suppose it is a standard 32 kHz clock crystal).

Two Examples:

Compatible Devices:

DS 12887	Dallas Semiconductor is now at Maxim Semiconductor	This device is on the scan Ga586HX Rev1.56 of Motherboard-Praktikum on links on www.ga586hx.de
DS 12887A	Dallas Semiconductor is now at Maxim Semiconductor	The RAMClear pin on some Ga586HX boards is connected to GND, the CMOS-RAM will allways be cleared , so better use another device. And this device costs twice as much as the DS12887. If you have another mainboard, please check first if Pin 21 is connected to GND.
M48T86	SGT	.
BQ3285A	Benchmarq is now at Texas Instruments	.
BQ3287BQ	Benchmarq is now at Texas Instruments	This device is on my Gigabyte Ga586HX Rev 1.56

Source
RS-components Distributor in many countries

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