Work
I. Sr. Packaging Engineer
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Mechanical modeling in support of the development of wire bond, over-molded, BGA, and flip-chip packages.
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Thermo-mechanical analysis to reduce die cracks, solder failure, and interface delamination in micro-electronics packages.
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Fatigue and creep behaviors of packages under thermal cycle/shock load.
II. Mechanical Engineer (Intern) --- SYMBOL Technology Inc.
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Drop and shock simulations/analyses of Symbol's handheld computers (entire housing with internal assemblies) in support of the prototype design. Products include Gemini, PCT-8100, and UPS terminals.
III. Mechanical Engineer -- Dalian Design Institute of Mechanical & Electronic Technology
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Finite element programming for structural analysis of 3D frame and truss.
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Structural and vibration analysis for major, hanging, and supporting steel structures of two 1000-ton cold storage units.
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Structural design and stress analysis for a 42kg/24hrs ice machine with internal pumping and refrigeration system.
IV. Consultation for National Transportation Safety Board
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3D comprehensive modeling and analysis for the failure aircraft jackscrew under critical friction/wear-out.
V. Miscellaneous Projects
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Modal dynamic and stiffness analysis of precision motion systems.
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High-acceleration dynamic analysis for a high-stiffness piezoelectric energy supplier for missile excitation.
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Multi-step finite element modeling to reduce the residual stress in torque sensor fabrication.
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Nonlinear large deformation analysis of the broken central tank (under large internal pressure) of aircraft.